Our projects
From R&D to impact… we innovate through collaboration and partnerships.
From R&D to impact… we innovate through collaboration and partnerships.
We are…
Pioneers
Our teams have participated in many pioneering European and regional R&D projects, from multifunctional integrated circuits for satellite communications to low power architectures for secure wireless communications based on RISC-V.
Innovators
We are at the forefront of semiconductor innovation, mastering advanced 22 nm FDSOI technology to develop next-generation UWB transceivers. Our expertise in microelectronics has been key to shaping projects such as RISCCOM, co-funded by CDTI , the EU NextGenerationEU initiative, and the Spanish Government’s PERTE Chip Strategic Project to accelerate technology transfer and strengthen Europe’s semiconductor ecosystem.
Early adopters
We are using advanced GaN technology in the RHEIN project to develop next‑generation microelectronics that integrate RF / mixed‑signal front‑ends with embedded computing for secure, low power communications in industrial and mission‑critical environments.
Delivering impact
Early multi‑function integrated circuits for satellite communications delivering cost and environmental impact reduction through integration, supported by EATIC [can’t find a link for this] and the EU SME Instrument (Horizon 2020) scheme.
We are…
Pioneers
Our teams have participated in many pioneering European and regional R&D projects, from multifunctional integrated circuits for satellite communications to low power architectures for secure wireless communications based on RISC-V.
Innovators
We are at the forefront of semiconductor innovation, mastering advanced 22 nm FDSOI technology to develop next-generation UWB transceivers. Our expertise in microelectronics has been key to shaping projects such as RISCCOM, co-funded by CDTI , the EU NextGenerationEU initiative, and the Spanish Government’s PERTE Chip Strategic Project to accelerate technology transfer and strengthen Europe’s semiconductor ecosystem.
Early adopters
We are using advanced GaN technology in the RHEIN project to develop next‑generation microelectronics that integrate RF / mixed‑signal front‑ends with embedded computing for secure, low power communications in industrial and mission‑critical environments.
Delivering impact
Early multi‑function integrated circuits for satellite communications delivering cost and environmental impact reduction through integration, supported by EATIC [can’t find a link for this] and the EU SME Instrument (Horizon 2020) scheme.
We are…
Pioneers
Our teams have participated in many pioneering European and regional R&D projects, from multifunctional integrated circuits for satellite communications to low power architectures for secure wireless communications based on RISC-V.
Innovators
We are at the forefront of semiconductor innovation, mastering advanced 22 nm FDSOI technology to develop next-generation UWB transceivers. Our expertise in microelectronics has been key to shaping projects such as RISCCOM, co-funded by CDTI , the EU NextGenerationEU initiative, and the Spanish Government’s PERTE Chip Strategic Project to accelerate technology transfer and strengthen Europe’s semiconductor ecosystem.
Early adopters
We are using advanced GaN technology in the RHEIN project to develop next‑generation microelectronics that integrate RF / mixed‑signal front‑ends with embedded computing for secure, low power communications in industrial and mission‑critical environments.
Delivering impact
Early multi‑function integrated circuits for satellite communications delivering cost and environmental impact reduction through integration, supported by EATIC [can’t find a link for this] and the EU SME Instrument (Horizon 2020) scheme.